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Nanya Technology (Taiwan)

Every collected paper, preprint and grant naming this institution, exactly as the source spells it.

  • PaperIEEE Transactions on Components Packaging and Manufacturing TechnologySourcedOpenAlex, as fetchedOpen the source → citationsHigh-bandwidth memory stacking yield

    Recent Advances and Trends in Cu–Cu Hybrid Bonding

    In this study, the recent advances and trends in Cu–Cu hybrid bonding will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (opportunities), and examples of Cu–Cu bumpless hybrid bonding. Also, some recommendations will be…

    Nanya Technology (Taiwan)

    Fundamental research · No laboratory or pilot wording.From OpenAlex · not yet reviewedDOI

  • PaperIEEE Transactions on Components Packaging and Manufacturing TechnologySourcedOpenAlex, as fetchedOpen the source → citationsAdvanced packaging capacity

    Recent Advances and Trends in Advanced Packaging

    In this study, advanced packaging is defined. The kinds of advanced packaging are ranked based on their interconnect density and electrical performance, and are grouped into 2-D, 2.1-D, 2.3-D, 2.5-D, and 3-D IC integration, which will be presented and discussed. Chiplet design…

    Nanya Technology (Taiwan)

    Fundamental research · No laboratory or pilot wording.From OpenAlex · not yet reviewedDOI