Advanced packaging capacity

• Capacity · company: TSMCTSMC CoWoS monthly capacity (reported)75,000SourcedTrendForce News (citing Economic Daily News / industry estimates) · Dec 2025Open the source →Check this number with Ask wafers/monthDec 2025+114%How this is computedThe latest value in a series minus the value before it, divided by the earlier value, same series and unit.35,000 (2024) → 75,000 (Dec 2025).Method →Code →Check this number with Ask vs 2024 · loosens

  TSMC does not publish CoWoS capacity; these are press estimates, labelled by when they were made.

  20,000

  40,000

  60,000

  80,000

  35,000 wafers/month2024TrendForce News (citing Taiwanese press / institutional investors) ↗75,000 wafers/monthDec 2025TrendForce News (citing Economic Daily News / industry estimates) ↗

  2024Dec 2025

  Period	Value	Source
  Dec 2025	75,000SourcedTrendForce News (citing Economic Daily News / industry estimates) · 2025-12-08Open the source →Check this number with Ask wafers/month	TrendForce News (citing Economic Daily News / industry estimates) ↗ secondary reportTSMC aims to scale monthly CoWoS capacity from today’s 75,000–80,000 wafers to as high as 120,000–130,000.Range 75,000-80,000; low end recorded
  2024	35,000SourcedTrendForce News (citing Taiwanese press / institutional investors) · 2024-12-13Open the source →Check this number with Ask wafers/month	TrendForce News (citing Taiwanese press / institutional investors) ↗ secondary reportTSMC’s monthly CoWoS production capacity reaches 35,000 wafers this year, contributing approximately 7%–9% of the company’s total revenue.Press estimate, not a TSMC disclosure

  Read from the sources Read from the source by an agent; quote matched mechanically against the fetched page; not yet reviewed by a person, 2026-09-24. Each value links the page it came from and quotes the sentence that carries it.

  Series pageDownload CSV

• Other · WorldCoWoS supply-demand gap10SourcedTrendForce News (citing Taiwanese press) · Dec 2026Open the source →Check this number with Ask %Dec 2026 · target or forecast−50%How this is computedThe latest value in a series minus the value before it, divided by the earlier value, same series and unit.20 (Jun 2026) → 10 (Dec 2026).Method →Code →Check this number with Ask vs Jun 2026

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  20 %Jun 2026TrendForce News (citing Taiwanese press) ↗10 %Dec 2026TrendForce News (citing Taiwanese press) ↗

  Jun 2026Dec 2026

  Period	Value	Source
  Dec 2026	10SourcedTrendForce News (citing Taiwanese press) · 2026-06-15Open the source →Check this number with Ask % target or forecast	TrendForce News (citing Taiwanese press) ↗ secondary reportthe CoWoS supply-demand gap is expected to narrow significantly from around 20% currently to about 10% by the end of 2026Projection
  Jun 2026	20SourcedTrendForce News (citing Taiwanese press) · 2026-06-15Open the source →Check this number with Ask %	TrendForce News (citing Taiwanese press) ↗ secondary reportthe CoWoS supply-demand gap is expected to narrow significantly from around 20% currently to about 10% by the end of 2026Shortfall of supply vs demand, approximate

  Read from the sources Read from the source by an agent; quote matched mechanically against the fetched page; not yet reviewed by a person, 2026-09-24. Each value links the page it came from and quotes the sentence that carries it.

  Series pageDownload CSV

• Capacity · company: TSMCTSMC CoWoS monthly capacity (projection)90,000SourcedTrendForce News (citing Taiwanese press / institutional investors) · Dec 2026Open the source →Check this number with Ask wafers/monthDec 2026 · target or forecast+29%How this is computedThe latest value in a series minus the value before it, divided by the earlier value, same series and unit.70,000 (Dec 2025) → 90,000 (Dec 2026).Method →Code →Check this number with Ask vs Dec 2025

  TSMC does not publish CoWoS capacity; these are press estimates, labelled by when they were made.

  70,000

  80,000

  90,000

  75,000 wafers/month2025TrendForce News (citing Taiwanese press) ↗70,000 wafers/monthDec 2025TrendForce News (citing Taiwanese press / institutional investors) ↗90,000 wafers/monthDec 2026TrendForce News (citing Taiwanese press / institutional investors) ↗

  2025Dec 2026

  Period	Value	Source
  Dec 2026	90,000SourcedTrendForce News (citing Taiwanese press / institutional investors) · 2024-12-13Open the source →Check this number with Ask wafers/month target or forecast	TrendForce News (citing Taiwanese press / institutional investors) ↗ secondary reportBy the end of 2026, capacity is expected to grow further to 90,000 wafers per month.Projection made Dec 2024; superseded by higher Dec 2025 estimate
  Dec 2025	70,000SourcedTrendForce News (citing Taiwanese press / institutional investors) · 2024-12-13Open the source →Check this number with Ask wafers/month	TrendForce News (citing Taiwanese press / institutional investors) ↗ secondary reportBy the end of 2025, its monthly CoWoS capacity is projected to reach 70,000 wafers, with its revenue contribution surpassing 10%.Projection made Dec 2024
  2025	75,000SourcedTrendForce News (citing Taiwanese press) · 2025-01-02Open the source →Check this number with Ask wafers/month	TrendForce News (citing Taiwanese press) ↗ secondary reportTSMC’s CoWoS monthly capacity could reach a record high of 75,000 wafers in 2025—nearly doubling 2024 levels.Projection made Jan 2025

  Read from the sources Read from the source by an agent; quote matched mechanically against the fetched page; not yet reviewed by a person, 2026-09-24. Each value links the page it came from and quotes the sentence that carries it.

  Series pageDownload CSV

• Other · company: TSMCTSMC advanced packaging share of revenue10SourcedTSMC 4Q25 earnings call transcript · 2025Open the source →Check this number with Ask %2025+25%How this is computedThe latest value in a series minus the value before it, divided by the earlier value, same series and unit.8 (2024) → 10 (2025).Method →Code →Check this number with Ask vs 2024

  8

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  8 %2024TSMC 4Q25 earnings call transcript ↗10 %2025TSMC 4Q25 earnings call transcript ↗

  20242025

  Period	Value	Source
  2025	10SourcedTSMC 4Q25 earnings call transcript · 2026-01-15Open the source →Check this number with Ask %	TSMC 4Q25 earnings call transcript ↗ primarythe revenue contribution last year from advanced packaging is slightly over 10% (corrected by company after the call). It's about 8% in 2024.Stated as "slightly over 10%"
  2024	8SourcedTSMC 4Q25 earnings call transcript · 2026-01-15Open the source →Check this number with Ask %	TSMC 4Q25 earnings call transcript ↗ primarythe revenue contribution last year from advanced packaging is slightly over 10% (corrected by company after the call). It's about 8% in 2024.Stated as "about 8%"

  Read from the sources Read from the source by an agent; quote matched mechanically against the fetched page; not yet reviewed by a person, 2026-09-24. Each value links the page it came from and quotes the sentence that carries it.

  Series pageDownload CSV

• Capacity · company: TSMCTSMC capex share for advanced packaging, masks and others20SourcedTSMC 4Q25 earnings call transcript · 2026Open the source →Check this number with Ask %2026

  Period	Value	Source
  2026	20SourcedTSMC 4Q25 earnings call transcript · 2026-01-15Open the source →Check this number with Ask %	TSMC 4Q25 earnings call transcript ↗ primaryabout 10 to 20 percent will be spent for advanced packaging, testing, mask making and othersRange 10-20% of 2026 capital budget; recorded upper bound

  Read from the sources Read from the source by an agent; quote matched mechanically against the fetched page; not yet reviewed by a person, 2026-09-24. Each value links the page it came from and quotes the sentence that carries it.

  Series pageDownload CSV

• Capacity · company: TSMCTSMC planned CoWoS capacity expansion by 202760SourcedTrendForce press release · 2027Open the source →Check this number with Ask %2027 · target or forecast

  Period	Value	Source
  2027	60SourcedTrendForce press release · 2026-04-30Open the source →Check this number with Ask % target or forecast	TrendForce press release ↗ primaryaided by order spillover and TSMC’s plan to expand CoWoS capacity by over 60% by 2027TrendForce own research press release; ">60%"; baseline year not specified in the sentence

  Read from the sources Read from the source by an agent; quote matched mechanically against the fetched page; not yet reviewed by a person, 2026-09-24. Each value links the page it came from and quotes the sentence that carries it.

  Series pageDownload CSV

Every series on every bottleneck — filter, compare and download.

Accelerator output is gated by how many dies can be packaged onto an interposer, not by wafer starts. Capacity is allocated ahead and demand has still run past it, which makes the allocation itself the scarce good.

Part of the process · Compute, which takes quarters to years to loosen once somebody decides to.

11How this is computedSum of four judged scores, each 0–3: concentration + substitution + lead time + inelasticity.Method →Code →Check this number with Ask / 12

Accelerator output is set by CoWoS-class capacity, allocated ahead and still short of demand. The allocation is the scarce good.

• 2024-12-05United StatesSlows building

  Foreign-produced direct product rule additions, including controls on high-bandwidth memory

  Brought the memory stacks that feed AI accelerators inside the export-control perimeter.

  Bureau of Industry and Security, Department of Commerce ↗

All policy →

• Hybrid bonding7/9Estimate, not a measurementIn production for some image sensors and logic stacks; ramping for memory stacks.By Substrata, open to challenge · 2026-09-15Supporting source →Check this number with Ask · Pilot running in the real environment

  More function per package reduces how much packaging capacity a given amount of compute needs.

All science →

1. Research68 (Computed: Items per stage = papers, preprints and grants collected for the bottleneck whose relevance score is 2 or more, placed on a stage by the rule in lib/science.ts; judgements are counted separately.)+7 (Computed: Items first collected in the last 7 days whose publication or award date is within the last 30 days.) new
2. Lab4 (Computed: Items per stage = papers, preprints and grants collected for the bottleneck whose relevance score is 2 or more, placed on a stage by the rule in lib/science.ts; judgements are counted separately.)+1 (Computed: Items first collected in the last 7 days whose publication or award date is within the last 30 days.) new
3. Pilot6 (Computed: Items per stage = papers, preprints and grants collected for the bottleneck whose relevance score is 2 or more, placed on a stage by the rule in lib/science.ts; judgements are counted separately.)
4. Early0 (Computed: Items per stage = papers, preprints and grants collected for the bottleneck whose relevance score is 2 or more, placed on a stage by the rule in lib/science.ts; judgements are counted separately.)
5. Scale0 (Computed: Items per stage = papers, preprints and grants collected for the bottleneck whose relevance score is 2 or more, placed on a stage by the rule in lib/science.ts; judgements are counted separately.)

judged, with a citation claimed, no citationNumber: papers, preprints and grants the feeds collected — unreviewed

• Paper2026-10-13Applied and Computational Engineering0SourcedOpenAlex, as fetchedOpen the source →Check this number with Ask citations

  Network-on-Chip Technology for Chiplet Integration Architecture ↗

  In today's era, the marginal benefits of transistor scaling are continuously decreasing, and Chiplet heterogeneous integration has become the mainstream path for scaling AI chip computing power. Meanwhile, on-chip interconnect performance is increasingly becoming the key factor…

  Fundamental research · No laboratory or pilot wording.From OpenAlex · not yet reviewedDOI

• Paper2026-10-13Zenodo (CERN European Organization for Nuclear Research)0SourcedOpenAlex, as fetchedOpen the source →Check this number with Ask citations

  MICROSOFT MAIA 300 // N2P MULTI-CHIPLET // 288GB HBM4. ↗

  MICROSOFT MAIA 300 // N2P MULTI-CHIPLET // 288GB HBM4.

  Fundamental research · No laboratory or pilot wording.From OpenAlex · not yet reviewedDOI

• Paper2026-10-11Polymers0SourcedOpenAlex, as fetchedOpen the source →Check this number with Ask citations

  Recent Advances in Performance-Driven Multiscale Strategies for Epoxy-Based Underfill Materials for Advanced Packaging ↗

  The rapid evolution of advanced packaging toward high-density, high-power, and three-dimensional heterogeneous integration has placed increasingly stringent demands on package reliability, particularly because of the thermal expansion mismatch and associated thermomechanical…

  Key Laboratory of Functional Materials and Applications of Fujian ProvinceXiamen University of Technology

  Fundamental research · No laboratory or pilot wording.From OpenAlex · not yet reviewedDOI

• Preprint2026-10-07Research Square0SourcedOpenAlex, as fetchedOpen the source →Check this number with Ask citations

  Semantic D2D Gateway Firewalls for Multi-Tenant Chiplet NoC Resource Isolation ↗

  Fundamental research · No laboratory or pilot wording.From OpenAlex · not yet reviewedDOIPDF

• Paper2026-10-06ACM Transactions on Architecture and Code Optimization0SourcedOpenAlex, as fetchedOpen the source →Check this number with Ask citations

  A Bandwidth-Balanced Adaptive Technique for Mesh-Based I/O Chiplets ↗

  As the semiconductor industry rapidly embraces chiplet-based architectures to satisfy AI-driven high-performance computing demands, the flexible, scalable I/O‑Die (IOD) chiplet offers a promising path toward solving the AI memory wall. However, the design of these IOD chiplets…

  American Rock Mechanics Association

  Fundamental research · No laboratory or pilot wording.From OpenAlex · not yet reviewedDOIPDF

The full pipeline, by stage →

• 2026-09-15open until 2027-03-31

  Through 2026, high-bandwidth memory supply rather than leading-edge wafer supply will be the stated limit on AI accelerator shipments.

  Settled by · Earnings calls or guidance from an accelerator maker or a memory maker naming which of the two limited shipments during 2026.

All calls →

1. 2026-07-29
   NeutralMilestoneDE

   SUSS plans a €45 million Advanced Packaging application and development center in Karlsruhe.

   suss.com ↗official source

   The sentence that says so

   “SUSS, a leading manufacturer of equipment and process solutions for the semiconductor industry, plans to invest approximately €45 million in a new application and development center in Karlsruhe (Baden-Württemberg, Germany), significantly expanding its innovation capacities in Advanced Packaging.”

   Check this

All events →

• Software scaffoldone turn: Minutes

  Worst judgement on this loop: 11 of 12How this is computedThe highest severity score among the bottlenecks recorded as gates on the loop.Method →Code →Check this number with Ask, judged 2026-09-15

• Frontier training runone turn: Weeks to months

  Worst judgement on this loop: 11 of 12How this is computedThe highest severity score among the bottlenecks recorded as gates on the loop.Method →Code →Check this number with Ask, judged 2026-09-15

A loop is one design, build and measure turn. Severity is a dated judgement on a 0–12 scale, not a measurement, and the judgements are not added together — the figure shown is the worst single one.

• Hybrid bondingrelieved by

  source-backed readiness judgement

• Foreign-produced direct product rule additions, including controls on high-bandwidth memorygoverned by

  primary source

• South Koreafound in

  directory join, not a sourced finding

• Taiwanfound in

  directory join, not a sourced finding