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Advanced packaging capacity

Assembling several chips into one AI accelerator. How many exist is set here, not at the wafer.

The bottleneck itself →

Searched for “advanced packaging”, “chiplet”, “silicon interposer”, “fan-out wafer level” in titles and abstracts.

6 collected items, newest first ↓Judged by hand ↓Who is active ↓

All stagesFundamental researchApplied / labPilot / demonstrationEarly commercialAt scaleNewestMost cited

Pilot / demonstration — readiness 5 to 7 of the nine-point scale. Evidence it takes: A pilot line, field trial or demonstration announced by the organisation running it; a demonstration or SBIR Phase II grant.

Judged by hand

Readiness and substitute status, with reasoning
  • TechnologyPilot / demonstrationreadiness Estimate, not a measurementIn production for some image sensors and logic stacks; ramping for memory stacks.By Substrata, open to challenge · 2026-09-15Supporting source →Judgement, cited · 2026-09-15

    Hybrid bonding

    In production for some image sensors and logic stacks; ramping for memory stacks.

    Source ↗

Collected by the feeds

Newest first
  • GrantEuropean CommissionEC::HE::HORIZON-RIASourcedOpenAIRE (EU and national funders)Open the source →

    Sustainable production line delivering advanced packaging for space missions

    To secure EU non-dependence in critical space electronics, the SUPERPACS consortium will build a European supply chain for advanced packaging technologies such as silicon interposer and ultra high-density organic interposers. Reduced line width and spacing (below 5 µm) for…

    Pilot / demonstration · Innovation or demonstration award.From OpenAIRE (EU and national funders) · not yet reviewed

  • GrantEuropean CommissionEC::HE::HORIZON-EICSourcedOpenAIRE (EU and national funders)Open the source →

    REplaceable Chiplet LInks for Quantum Scaling

    Quantum computers could transform industries and society, but to reach their full potential they must scale to millions of qubits. Current superconducting quantum processors (QPUs) are limited by several scaling factors, amongst which fabrication yield and packaging complexity: a…

    Pilot / demonstration · Innovation or demonstration award.From OpenAIRE (EU and national funders) · not yet reviewed

  • GrantUK Research and InnovationUKRI::EPSRCSourcedOpenAIRE (EU and national funders)Open the source →

    Chiplet-Guard: Proactive Threat Detection for Efficient and Interoperable Chiplet Security

    Chiplet-Guard is a pioneering research initiative addressing the security challenges of chiplet-based computing architectures. As the demand for high performance and energy efficiency grows, traditional monolithic System-on-Chip (SoC) designs face physical and economic…

    Pilot / demonstration · Innovation or demonstration award.From OpenAIRE (EU and national funders) · not yet reviewed

  • GrantUS National Science FoundationSTTR Phase IISourcedNSF awardsOpen the source →

    STTR Phase II: Miniature Precision Stage for High Throughput Hybrid Bonding

    The broader/commercial impact of this Small Business Technology Transfer (STTR) Phase II project is to develop a small form-factor precision stage to enable the high-volume manufacturing of next generation high-performance computing devices utilizing 3D stacked chiplets…

    SANGTERA INC

    Pilot / demonstration · SBIR/STTR Phase II award.From NSF awards · not yet reviewed

  • GrantEuropean CommissionEC::HE::HORIZON-JU-RIASourcedOpenAIRE (EU and national funders)Open the source →

    Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line

    As a contribution to the EU Chips Act, the Research Fab Microelectronics Germany (FMD) proposes an Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems Pilot Line (APECS-PL), which combines the generation of globally competitive high technology…

    Pilot / demonstration · Innovation or demonstration award.From OpenAIRE (EU and national funders) · not yet reviewed

  • GrantUS National Science FoundationSBIR Outreach & Tech. Assist, STTR Phase ISourcedNSF awardsOpen the source →

    STTR Phase I: Microhydraulic Actuator for High-Accuracy, High-Speed Position Stages

    The broader impact/commercial potential of this Small Business Technology Transfer (STTR) Phase I project is to develop the key technology to enable the building of high-precision, high-throughput, semiconductor advanced packaging systems to enable broad adoption of the 3D…

    SANGTERA INC

    Pilot / demonstration · Innovation or demonstration award.From NSF awards · not yet reviewed