What if it fails?

Step one · 1How this is computedDirect hits: bottlenecks where the failed node is a maker, a part supplier or the location. Makers wholly inside it are lost; makers also operating elsewhere are partly affected; the rest remain. Downstream: every bottleneck that needs a hit one, transitively, through recorded rows. Exposed: holders of hit and downstream bottlenecks and companies a filing says need or sell into them.Method →Code →Check this number with Ask bottleneck hit directly

Step two · 4How this is computedDirect hits: bottlenecks where the failed node is a maker, a part supplier or the location. Makers wholly inside it are lost; makers also operating elsewhere are partly affected; the rest remain. Downstream: every bottleneck that needs a hit one, transitively, through recorded rows. Exposed: holders of hit and downstream bottlenecks and companies a filing says need or sell into them.Method →Code →Check this number with Ask downstream through recorded inputs

• Electronic-grade polysilicon → 300 mm prime silicon wafers

  An input to 300 mm prime silicon wafers is disrupted. Whether it stops depends on inventory and substitution the corpus does not record.

  Evidence for each step

  • 300 mm prime silicon wafers needs Electronic-grade polysiliconOur hyper-pure polysilicon becomes fabricated wafers and integrated circuit chips used by leading semiconductor manufacturers.Primary source

• Electronic-grade polysilicon → 300 mm prime silicon wafers → Leading-edge foundry capacity

  An input to Leading-edge foundry capacity is disrupted. Whether it stops depends on inventory and substitution the corpus does not record.

  Evidence for each step

  • 300 mm prime silicon wafers needs Electronic-grade polysiliconOur hyper-pure polysilicon becomes fabricated wafers and integrated circuit chips used by leading semiconductor manufacturers.Primary source
  • Leading-edge foundry capacity needs 300 mm prime silicon wafers300 mm Non-memory chip / MPU / CIS / Logic (Driver IC)Primary source · A wafer maker’s product table: 300 mm wafers go to logic. It does not name a node.

• Electronic-grade polysilicon → 300 mm prime silicon wafers → High-bandwidth memory stacking yield

  An input to High-bandwidth memory stacking yield is disrupted. Whether it stops depends on inventory and substitution the corpus does not record.

  Evidence for each step

  • 300 mm prime silicon wafers needs Electronic-grade polysiliconOur hyper-pure polysilicon becomes fabricated wafers and integrated circuit chips used by leading semiconductor manufacturers.Primary source
  • High-bandwidth memory stacking yield needs 300 mm prime silicon wafers300 mm Memory chip / DRAM / Flash(NAND)Primary source · DRAM in general; HBM is stacked DRAM.

• Electronic-grade polysilicon → 300 mm prime silicon wafers → Leading-edge foundry capacity → Advanced packaging capacity

  An input to Advanced packaging capacity is disrupted. Whether it stops depends on inventory and substitution the corpus does not record.

  Evidence for each step

  • 300 mm prime silicon wafers needs Electronic-grade polysiliconOur hyper-pure polysilicon becomes fabricated wafers and integrated circuit chips used by leading semiconductor manufacturers.Primary source
  • Leading-edge foundry capacity needs 300 mm prime silicon wafers300 mm Non-memory chip / MPU / CIS / Logic (Driver IC)Primary source · A wafer maker’s product table: 300 mm wafers go to logic. It does not name a node.
  • Advanced packaging capacity needs Leading-edge foundry capacityso that various chiplets such as SoC and and high bandwidth memory (HBM) can be placed on itPrimary source · TSMC’s 2022 annual report on the CoWoS interposer. The SoC dies are the logic side.

Step three · 32How this is computedDirect hits: bottlenecks where the failed node is a maker, a part supplier or the location. Makers wholly inside it are lost; makers also operating elsewhere are partly affected; the rest remain. Downstream: every bottleneck that needs a hit one, transitively, through recorded rows. Exposed: holders of hit and downstream bottlenecks and companies a filing says need or sell into them.Method →Code →Check this number with Ask companies exposed, 29How this is computedOrganisations recorded on a bottleneck (maker, capacity holder or part supplier) whose shares, or a parent’s, trade on an exchange found in the SEC ticker file or OpenFIGI.Method →Code →Check this number with Ask with a listing

Exposure is a recorded relation, not a size, and not a direction: a remaining maker may gain as much as a dependent loses.

Step four · what the record says about recovery

No recovery date is computed: the corpus holds no measured lead-time series. What it holds is shown with its basis.

• Electronic-grade polysilicon

  Lead-time test

  2/3Estimate, not a measurementFive producers at eleven nines; capacity is being added (Tokuyama Vietnam, OCI). Not binding, and the loosening events say so.By Substrata, open to challenge · 2026-09-15Check this number with Ask — decision to new capacity, a judged score in the assessment

  Relief time at this stage

  Years, per qualificationEstimate, not a measurementOrder-of-magnitude time from a decision to relief at this stage of the loop. Illustrative: chosen by hand, not taken from a measured lead-time dataset.By Substrata, open to challenge · 2026-09-15Check this number with Ask (Materials & tools, order of magnitude)